List
PECVD
Process
-Low temp. SiNx depostion
-Low temp. SiON depostion
-Low temp. SiO2 depositon
Applications
Flexible OLED encapsulation
ON cell touch screen panel
Introduction.
PECVD is used to prevent moisture penetration of fiexible OLED devices. IPS PECVD has deposited SiNx thin films with optimized optical transmittance and stress for flexible OLEDs and has excellent self-cleaning performance, which can lower the production cost of the customer.
Technology.
PECVD(Plasma-Enhanced Chemical Vapor Deposition) As the OLED was changed to flexible, a TFE (Thin Film Encapsulation) replacing the glass cover window was needed. The type of TFE film is SiNx or SiON or SiO2 and the stress of the thin film is important because it used for flexible
Features.
1. CCP plasma mode (13.56MHz) 2. Gen.5.5 ~ Gen.8 glass 3. SiNx, SiON, SiO2 film deposition 4. Film uniformity <3%, Deposition rate > 2500A/min 5. Optimized stress & transmittance 6. WVTR <E-6g/m^2day) 7.High in-situ cleaning rate 17,000A/min
Related products
Product and technical inquiries
TEL : +86 130 6282 3734 E-mail : fpd@ips.co.kr