List
Cryster series 600 (PI curing)
Process
PI curing
Applications
Flexible OLED TFT Backplane
(Mobile)
Introduction.
Polyimide (PI) curing equipment specializes in thermal treatment to implement a flexible substrate in the flexible display manufacturing process.
Technology.
This equipment implements a wide range of temperature from high to low and is capable of optimizing the client’s process requirements. It applies IPS’s original fast ramp up/down function and delivers high productivity. In addition, the equipment applies a dynamic flow control system which completely discharges by-products created during curing, and thereby can control and prevent the condensation of by-products inside the chamber.
Features.
1. Glass size: up to 8G 2. Max. temperature: up to 500℃ 3. Front door specially manufactured to control very high temperature uniformity 4. Fully open rear door, which is easy to maintain 5. Gas injection system specially manufactured to provide a uniform gas laminar flow for an optimal process 6. Fast ramping process (FRP) which can implement high productivity and a precision process with special technology capable of fast heating and cooling 7. Special recipe specializing in discharging solvents 8. Inside structure specializing in inhibiting extreme particles 9. Cooling stage specially manufactured for optimal aligning and fast cooling
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Product and technical inquiries
TEL : 82-31-831-2723 E-mail : fpd@ips.co.kr