List
GEMINI HQ
Process
- SiON
- a-Si
- TEOS
Applications
- Anti Reflective Coating
- Hardmask Dielectric
Introduction.
GEMINI CVD system produces dielectric films with plasma-enhanced chemical vapor deposition technology such as Anti-Reflective Coating and hardmask. Our PECVD system provides excellent ALD-like superior uniformity performance. In addition, GEMINI a-Si films are widely used in DPT/QPT hard-mask patterning solution for advanced DRAM and Logic devices beyond 20nm.
Technology.
As device scales down, uniformity is important as it can affect wafer CD variation which leads to poor device fabrication. Since dielectric films are used to form insulating features in a semiconductor device, it requires films that are exceptionally smooth as it will affect subsequent layers. GEMINI PECVD dielectric films are well-known for its extremely outstanding uniformity. Not only it has a superior productivity, but also it significantly reduces cost of ownership with very high- throughput.
Features.
- High Throughput - Extreme Thickness Uniformity (TEOS/SiON - <0.5%) - Excellent Tool Matching → User Friendly New S/W, Distribution Control System, Ether-CAT - Process Reliability → TCS, Precision Moving Assembly - Wide TEOS Process Window(Thin to Ultra High Thickness with ESC for Backside Deposition free)
