List
WIDAS
Process
Oxidation
Anneal
Alloy
PI bake
Poly
ALD Ox/SiN
Applications
STI
Mask
Gap fill
Liner
Spacer
Buffer
Introduction.
WIDAS is an expansion platform of WINAS, enhances the process capacity per batch, applies more improved key module technologies (heater, robot, and controller), and provides outstanding process capability.
Technology.
Like WINAS, it can maximize the formation of uniform thin films and the inhibition of particles and metal impurities through extraordinary temperature control technology and an original and stable chamber structure. Above all, WIDAS’s strength is that it can maximize per batch productivity and greatly reduce equipment investment and maintenance costs.
Features.
- High productivity : up to 175 wafers per batch - High precision temperature / pressure control technology - Excellent film thickness uniformity (WiW, WtW & BtB) - Excellent step coverage (>95%) - Fast ramp up & down heater - Reliable mechtronics
